Process for producing encapsulated semiconductor device having m

Details Process for producing encapsulated semiconductor device having m Process for producing encapsulated semiconductor device having m

1997-11-25

1999-05-18

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

26427217, H01L21/56

Patent

active

059045051

ABSTRACT:
A process for producing a metal foil-covered semiconductor device. The metal foil material is one which is, in molding a resin for encapsulating a semiconductor element using a mold, temporarily fixed on a surface of a cavity of the mold, and is adhered on a surface of a semiconductor device by injecting the encapsulating resin into the mold and molding the resin, wherein a contact angle of the face of the metal foil material which is in contact with the encapsulating resin during molding, to water is 110.degree. or less.

REFERENCES:
patent: 4524098 (1985-06-01), Shimizu et al.
patent: 4867839 (1989-09-01), Sato et al.
patent: 5674343 (1997-10-01), Hotta et al.

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