4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant

Seiji Kondoh

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Encapsulated semiconductor device having metal foil covering, an

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Process for producing encapsulated semiconductor device having m

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Profile ID: LFUS-PAI-P-1517179

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