Systems for forming films having high dielectric constants

Details Systems for forming films having high dielectric constants Systems for forming films having high dielectric constants

1996-09-12

1999-06-08

Mach, D. Margaret M.

Coating apparatus

Gas or vapor deposition

Multizone chamber

118728, 257310, C23C 1600, H01L 27108

Patent

active

059102187

ABSTRACT:
A method form forming a dielectric film on a substrate includes the steps of placing the substrate in a process chamber wherein said substrate is isolated from an external environment, depositing the dielectric film on the substrate in the process chamber, and annealing the dielectric film in said process chamber. In particular, the dielectric film can be formed from Ta.sub.2 O.sub.5. Systems for forming the dielectric film are also disclosed.

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