Method for connecting packages of a stacked ball grid array stru

Details Method for connecting packages of a stacked ball grid array stru Method for connecting packages of a stacked ball grid array stru

1995-11-14

1998-07-21

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257686, 257777, 257778, 361733, 361735, 361744, 361764, 361784, 361803, H01L 2500

Patent

active

057838704

ABSTRACT:
Stackable ball grid array packages are disclosed, wherein a plurality of separate ball grid array packages may be stacked, one on top of another, and interconnected by conductive terminals located on opposite surfaces of each of the ball grid array packages. Thus, the mounting of ball grid array packages on a printed circuit board may be conducted in three dimensions rather than two dimensions, requiring considerably less printed circuit board surface area and reducing parasitic inductances and capacitances between the terminals of the stacked ball grid array packages. An air gap is formed between adjacent, stacked packages for cooling. Connections between adjacent packages are made by conductive epoxy and noble metal balls.

REFERENCES:
patent: 4942454 (1990-07-01), Mori et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5222014 (1993-06-01), Lin
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5454160 (1995-10-01), Nickel

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