Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1998-05-18
2000-11-07
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257780, 257784, 257783, 257778, H01L 2348
Patent
active
061441023
ABSTRACT:
The objective of the invention is to reduce the thickness, to improve the heat-releasing property, and to increase the number of terminals that can be assembled, in particular, for the CSP-type semiconductor package. According to this invention, insulating substrate 3 having multiple conductor leads 7 is contained on the first surface. Semiconductor chip 1 equipped with multiple electrode pads 2, which has multiple electrode pads 2 on its principal surface 1, is carried on said insulating substrate 3 with its principal surface facing the aforementioned first surface. Insulating substrate 3 has openings 4 and 5 for exposing inner leads 7a of the conductor leads, as well as multiple electrode pads 2 on the second surface side. Inner leads 7a and electrode pads 2 are connected to each other through conductor leads 9 via said openings 4 and 5. Outer connecting terminals 11 are connected to outer leads 7b of the conductor leads.
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patent: 5844168 (1998-12-01), Shueller et al.
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patent: 6028356 (2000-02-01), Kimura
patent: 6054773 (2000-04-01), Ohsawa et al.
Clark Sheila V.
Kempler William B.
Telecky Jr. Frederick J.
Texas Instruments Incorporated
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