Solder interconnection structure

Details Solder interconnection structure Solder interconnection structure

1993-05-06

1997-08-12

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257687, 257786, 257793, 2281801, 22818022, 4284111, 4284228, 528107, 528122, 528210, 361765, H01L 2348, H01L 2940, H01L 3902

Patent

active

056568622

ABSTRACT:
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.

REFERENCES:
patent: 4999699 (1991-03-01), Christie et al.
patent: 5089440 (1992-02-01), Christie et al.
patent: 5121190 (1992-06-01), Hsiao et al.
patent: 5250848 (1993-10-01), Christie et al.
patent: 5536765 (1996-07-01), Papathomas

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