Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent
1995-10-12
1998-09-22
Ryan, Patrick
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Opposed registering coacting female molds
26427211, 26427217, 4251291, 425544, 425568, B29C 4514
Patent
active
058111328
ABSTRACT:
An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.
REFERENCES:
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5326243 (1994-07-01), Fierkens
patent: 5356283 (1994-10-01), Hamada et al.
patent: 5401155 (1995-03-01), Shikagawa et al.
patent: 5635220 (1997-06-01), Izumi et al.
Cho In Sik
Choi Hee Kook
Park Tae Sung
Rho Hee Sun
Leyson Joseph
Ryan Patrick
Samsung Electronics Co,. Ltd.
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