Method of manufacturing probing head for testing equipment of se

Details Method of manufacturing probing head for testing equipment of se Method of manufacturing probing head for testing equipment of se

1989-05-30

1990-08-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156626, 156634, 156643, 156652, 156656, 1566611, 20412965, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

049522728

ABSTRACT:
A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.

REFERENCES:
patent: 4585991 (1986-04-01), Reid et al.

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