Hermetic thin film metallized sealband for SCM and MCM-D modules

Details Hermetic thin film metallized sealband for SCM and MCM-D modules Hermetic thin film metallized sealband for SCM and MCM-D modules

1995-06-05

1998-04-28

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257678, 257704, 257779, 257781, H01L 2302

Patent

active

057447527

ABSTRACT:
A module for encapsulating a microelectronic device has a polished mating surface around the periphery of the substrate on which is deposited at least one thin film sealband fabricated at a temperature no greater than about 400.degree. C. The sealband has a thickness of less than about 0.001 in. and comprising a metal capable of wetting molten solder which has a melting point no greater than about 400.degree. C. and adhering to the solder after solidification. A layer of the solder is disposed between the sealbands of the cap and substrate forming a hermetic seal for the module.

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