Method and apparatus for reducing resin bleed during the formati

Details Method and apparatus for reducing resin bleed during the formati Method and apparatus for reducing resin bleed during the formati

1997-05-22

2000-07-04

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257783, 257669, 257674, 257676, 257643, 257785, H01L 2348, H01L 2352, H01L 2940

Patent

active

06084311&

ABSTRACT:
A semiconductor device assembly having a support such as a lead frame paddle comprises a coating thereon to reduce or eliminate the flow of die attach adhesive from under the die and over bond sites or encapsulation regions. Thus undesirable effects resulting from this flow of adhesive, such as wire bonding problems and encapsulation problems, are reduced. A method for forming the assembly is also described.

REFERENCES:
patent: 4535350 (1985-08-01), Goodrich et al.
patent: 5237205 (1993-08-01), Newman
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5319241 (1994-06-01), Lim
patent: 5455452 (1995-10-01), Kiyono
patent: 5514905 (1996-05-01), Sakuta et al.
patent: 5552637 (1996-09-01), Yamagata
patent: 5637913 (1997-06-01), Kajihara et al.
Elephane R-722 (For Taping Lead Frames) , Tomoegawa.

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