Method for manufacturing MOSFET

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438592, 438656, H01L 21336

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active

057599009

ABSTRACT:
A method of manufacturing a field effect transistor (FET) includes the steps of: sequentially forming a conductive layer and a semiconductor layer on a first conductivity type substrate; patterning the semiconductor layer to form a gate electrode; implanting second conductivity type impurity ions at a low concentration into a surface of the substrate using the gate electrode as a mask, to thereby form low-concentration impurity regions in the substrate; forming and patterning an insulating layer on an overall surface of the substrate to form insulating side-wall spacers on side-walls of the gate electrode; and implanting second conductivity type FET impurity ions at a high concentration into a surface of the substrate using the gate electrode and insulating side-wall spacers as an etch-mask, to thereby form high-concentration impurity regions in the substrate.

REFERENCES:
patent: 4907048 (1990-03-01), Huang
patent: 5061647 (1991-10-01), Roth et al.
patent: 5102815 (1992-04-01), Sanchez
patent: 5175119 (1992-12-01), Matsutani
patent: 5304504 (1994-04-01), Wei et al.
patent: 5583067 (1996-12-01), Sanchez
Fang, H. et al., "Low-Temperature Furnace-Grown Reoxidized Nitrided Oxide Gate Dielectrics as a Barrier to Boron Penetration", IEEE Electron Device Letters, 13(4): 217-219 (1992).
Wolf et al., "Chemical Vapor Deposition of Amorphous and Polycrystalline Films," Silicon Processing for the VLSI Era--vol. 1 (1986), p. 181.

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