Process for the wet-chemical surface treatment of semiconductor

Details Process for the wet-chemical surface treatment of semiconductor Process for the wet-chemical surface treatment of semiconductor

1991-03-06

1993-01-26

Jones, W. Gary

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 156662, 134 11, 134 28, 134 31, H01L 21306, B44C 122, C03C 1500

Patent

active

051819856

ABSTRACT:
A process for the wet-chemical surface treatment of semiconductor wafers in which aqueous phases containing one or more chemically active substances in solution act on the wafer surfaces, consisting of spraying a water mist over the wafer surfaces and then introducing chemically active substances in the gaseous state so that these gaseous substances combine with the water mist so that there is an interaction of the gas phase and the liquid phase taking place on the surface of the semiconductor wafer. Gases such as hydrogen fluoride, chlorine and ozonized oxygen or other halogen gases act on the wafer surfaces between rinsing steps so that when the wafers are dried, the surfaces achieve extremely high cleanliness levels.

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Hackh's Chemical Dictionary, Fourth edition, McGraw-Hill, 1972, p. 636.
Tabellenbuch Chemie, VED Deutscher Verlag der Grundstoffindustrie, 9. ed., pp. 164-165.

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