Semi-conductor personalization structure and method

Details Semi-conductor personalization structure and method Semi-conductor personalization structure and method

1998-05-18

2000-07-25

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 22818021, 22818022, H01L 2144

Patent

active

060936304

ABSTRACT:
The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and personalization lines. Vias are opened to the plurality of landing lines and selectively opened to a portion of the personalization lines. Connections are made between the opened personalization lines with bumps deposited as part of the bump array.

REFERENCES:
patent: 5093279 (1992-03-01), Andreshak et al.
patent: 5244837 (1993-09-01), Dennison
patent: 5436412 (1995-07-01), Ahmad et al.
patent: 5438166 (1995-08-01), Carey et al.
Bartlett, C., "Multichip Packaging Design for VLSI-Based Systems", IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-12, No. 4, Dec. 1987, pp. 647-653.
Cronin, J.E., "Method for Elimination of Scratches in Polished Damascene Conductors", Research Disclosure, Feb. 1991, No. 322, Kenneth Mason Publications, Ltd., England.
Heinen, et al., "Multichip Assembly with Flipped Integrated Circuits", IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 12, No. 4, Dec. 1989, pp. 650-657.
Miller, "Controlled Collapse Reflow Chip Joining", IBM Res. Develop., p. 239-250.

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