Semiconductor device having a tapeless mounting

Details Semiconductor device having a tapeless mounting Semiconductor device having a tapeless mounting

1996-11-27

1999-11-16

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257666, 257669, 257674, H01L 23495

Patent

active

059863358

ABSTRACT:
A semiconductor device having a photosensitive thermosetting resin layer 64 provided on top of a protective film 13 for a semiconductor chip 10. A lead frame 11 is affixed to the surface of this photosensitive thermosetting resin layer 64 only at support pin sections 60, 61, and this lead frame 11 is electrically connected to the surface of semiconductor chip 10. Breakage of the wiring and chip cracking are prevented after the pressure-bonding mounting of the lead frame. Because package cracking and package warping are better controlled in thermal processes such as such as IR reflow and resin sealing, a lower cost semiconductor device and manufacturing method are enabled.

REFERENCES:
patent: 4811081 (1989-03-01), Lyden
patent: 5206536 (1993-04-01), Lim
patent: 5227232 (1993-07-01), Lim
patent: 5261156 (1993-11-01), Mase et al.
patent: 5455452 (1995-10-01), Kiyono
patent: 5461255 (1995-10-01), Chan et al.
patent: 5510649 (1996-04-01), Adhihetty et al.

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