Folded bus bar leadframe and method of making

Details Folded bus bar leadframe and method of making Folded bus bar leadframe and method of making

1994-01-26

1994-10-25

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156645, 156656, 156651, 156901, 437220, B44C 122, C23F 100

Patent

active

053585984

ABSTRACT:
A leadframe has a bus bar extending between two lead fingers on the leadframe. The bus bar and lead fingers are etched to reduce the thickness thereof, and the bus bar is folded under the lead finger, but insulated therefrom by a strip of insulating material. An adhesive is applied to the bus bar to attached it and the leadframe to the surface of a semiconductor chip.

REFERENCES:
patent: 4987475 (1991-01-01), Schlesinger et al.
patent: 5200364 (1993-04-01), Loh
patent: 5229329 (1993-07-01), Chai et al.

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