Method of fabricating self-align-contact

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438303, 438595, H01L 218238, H01L 21336

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active

060431164

ABSTRACT:
A method of fabricating a self-align-contact is provided. Two gates are formed on a semiconductor substrate. A first spacer is formed on the sidewalls of the two gates, and a source/drain region is formed between the two gates. A first dielectric layer and a second dielectric layer are formed on the semiconductor substrate. The second dielectric layer is patterned. A self-align-contact opening is formed between the two gates by removing the first dielectric layer and the first spacer using the second dielectric layer as a mask. A second spacer is formed on the exposed sidewalls of the gate. The method of forming the second spacer includes forming an insulating layer that is about 200-100 .ANG. thick and anisotropically etching the insulating layer. The width of the second spacer is narrower than the width of the first spacer. A conductor layer is formed in the self-align-contact opening.

REFERENCES:
patent: 5073510 (1991-12-01), Kwon et al.
patent: 5620919 (1997-04-01), Godinho et al.
patent: 5683922 (1997-11-01), Jeng et al.
patent: 5728595 (1998-03-01), Fukase
patent: 5877081 (1999-03-01), Matsumoto et al.
patent: 5885895 (1999-03-01), Liu et al.

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