Photoresist laminate and method for patterning using the same

Details Photoresist laminate and method for patterning using the same Photoresist laminate and method for patterning using the same

1997-09-05

1999-07-20

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

4302711, 430919, 430921, G03C 1492

Patent

active

059254955

ABSTRACT:
A proposal is made for the photolithographic formation of a patterned resist layer on a substrate without the troubles due to reflection of the exposure light on the substrate surface. Thus, patterning is conducted on a photoresist laminate comprising (a) a substrate; (b) a specific anti-reflection coating layer formed on one surface of the substrate; and (c) a photoresist layer formed on the anti-reflection coating layer from a specific negative-working chemical-sensitization photoresist composition comprising an oxime sulfonate acid generating agent. The patterning procedure comprises the steps of: (A) exposing, pattern-wise to actinic rays, the photoresist layer of the photoresist laminate; (B) subjecting the photoresist layer to a heat treatment; (C) subjecting the photoresist layer to a development treatment to dissolve away the photoresist layer in the areas unexposed to actinic rays in step (A) so as to expose bare the anti-reflection coating layer in the areas unexposed to the actinic rays leaving a patterned resist layer in the areas exposed to the actinic rays; and (D) removing the pattern-wise exposed anti-reflection coating layer by dry etching with the patterned photoresist layer as a mask.

REFERENCES:
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patent: 4736055 (1988-04-01), Dietliker et al.
patent: 5019488 (1991-05-01), Mammato et al.
patent: 5126289 (1992-06-01), Ziger
patent: 5605775 (1997-02-01), Watanabe
patent: 5627011 (1997-05-01), Munzel et al.
patent: 5650262 (1997-07-01), Munzel et al.

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