Planar magnetron sputtering source producing improved coating th

Details Planar magnetron sputtering source producing improved coating th Planar magnetron sputtering source producing improved coating th

1993-02-25

1994-06-14

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

2042982, C23C 1435

Patent

active

053207289

ABSTRACT:
A planar magnetron sputtering source having a pair of pole pieces configured to produce a uniform coating, excellent step coverage and excellent step coverage uniformity of a wafer. Between the two pole pieces is a gap within which the magnetic field and electric field produce an electron trap. The shape of the gap produces a depth of sputter profile in the target that results in the uniform coating, excellent step coverage and excellent step coverage uniformity.

REFERENCES:
patent: 4444643 (1984-02-01), Garrett
patent: 4714536 (1987-12-01), Freeman et al.
patent: 4746417 (1988-05-01), Ferenbach et al.
patent: 4872964 (1989-10-01), Suzuki et al.

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