Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1994-05-09
1995-11-14
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257763, 257770, 257753, 257750, H01L 2946, H01L 2954, H01L 2962
Patent
active
054669723
ABSTRACT:
Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti--Ti/Pd--Cu--Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer.
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patent: 4109297 (1978-08-01), Lesh
patent: 4554229 (1985-11-01), Small, Jr.
patent: 4601972 (1986-07-01), Small, Jr.
patent: 5288951 (1994-02-01), Frankenthal et al.
"Indentation-Debonding Test For Adhered Thin Polymer Layers," by Engel et al., Adhesion Aspects of Polymeric Coatings, (1983) pp. 583-595.
Frank Aaron L.
Ibidunni Ajibola O.
Johnson Douglas B.
Krause Dennis L.
Nguyen Trac
Alber Oleg E.
AT&T Corp.
Jackson Jerome
Kelley Nathan Kip
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