4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Ajibola O. Ibidunni

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Copper-based metallizations for hybrid integrated circuits

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Copper-based metallizations for hybrid integrated circuits

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent

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Metallization for polymer-dielectric multichip modules

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent

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Metallization for polymer-dielectric multichip modules including

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-328483

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