4. Etching a substrate: processes
  5. Forming or treating electrical conductor article
  6. Forming or treating of groove or through hole

Trac Nguyen

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Metallization for polymer-dielectric multichip modules

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
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Metallization for polymer-dielectric multichip modules including

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Thin film metallization for barium nanotitanate substrates

Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
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Profile ID: LFUS-PAI-P-555409

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