Semiconductor device and wire bonding method therefor

Details Semiconductor device and wire bonding method therefor Semiconductor device and wire bonding method therefor

1997-12-29

1999-11-23

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438612, 2281805, H01L 2144

Patent

active

059899956

ABSTRACT:
A semiconductor device including a bonded wire that connects a first bonding point and a second bonding point and has a linear portion in the top area thereof, the linear portion being bent or depressed down, thus having a high shape-retaining strength.

REFERENCES:
patent: 4932584 (1990-06-01), Yamazaki et al.
patent: 5148964 (1992-09-01), Shimizu
patent: 5156323 (1992-10-01), Kumazawa et al.
patent: 5205463 (1993-04-01), Holdgrafer et al.
patent: 5259548 (1993-11-01), Yamazaki et al.
patent: 5863810 (1999-01-01), Kaldenberg

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