4. Metal fusion bonding
  5. Process
  6. With condition responsive, program, or timing control

Shinichi Nishiura

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Ball formation method and ball forming device used in a wire...

Electric heating – Metal heating – Wire – rod – or bar bonding
Reexamination Certificate

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Ball forming device in a bonding apparatus and ball forming...

Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate

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Bonding wire loop shape for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Initial ball forming method for wire bonding wire and wire...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Initial ball forming method for wire bonding wire and wire...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1150933

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