Thermally efficient integrated circuit package

Details Thermally efficient integrated circuit package Thermally efficient integrated circuit package

1997-05-12

1998-08-18

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257675, 257676, 257796, H01L 23495

Patent

active

057961590

ABSTRACT:
A leadframe that exhibits improved thermal dissipation and that can be incorporated in standard integrated circuit (IC) package designs is provided by extending the inner lead portions along a major surface of an IC, and attaching a heat sink on a side of the inner lead portions opposite the IC. The inner lead portions conduct heat from the IC to the heat sink, where it is dissipated into the moulding compound and radiated into the air. In the preferred embodiment, the leads have outer portions that are arranged on only two opposing sides of the IC package and comprise four sets of leads that initially intersect the IC along four lateral sides. This allows for a larger number of leads to contribute to heat dissipation. Added thermal dissipation is achieved by making the inner portion of a ground lead wider than the inner portion of any other lead. In addition, existing IC package designs that utilize the present leadframe structure can accommodate larger ICs than before because the present leadframe structure does not require that the IC be positioned between the tips of the inner lead portions.

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