Method of manufacturing a polysilicon gate having a dimension be

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

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438595, H01L 213205, H01L 214763

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active

058664734

ABSTRACT:
A method of manufacturing an MOS transistor having a gate length dimension less than the dimension available by methods available with conventional manufacturing methods that are limited by optical diffraction in photolithography. The method includes forming a polysilicon gate structure on a gate oxide layer, forming a nitrogen-doped layer on the polysilicon gate structure, forming selected depth oxide sidewalls on the polysilicon gate structure and etching the nitrogen-doped layer and the oxide sidewalls.

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