Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Patent
1997-10-31
1999-02-02
Booth, Richard A.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
438595, H01L 213205, H01L 214763
Patent
active
058664734
ABSTRACT:
A method of manufacturing an MOS transistor having a gate length dimension less than the dimension available by methods available with conventional manufacturing methods that are limited by optical diffraction in photolithography. The method includes forming a polysilicon gate structure on a gate oxide layer, forming a nitrogen-doped layer on the polysilicon gate structure, forming selected depth oxide sidewalls on the polysilicon gate structure and etching the nitrogen-doped layer and the oxide sidewalls.
REFERENCES:
patent: 5476802 (1995-12-01), Yamazaki et al.
patent: 5712173 (1998-01-01), Liu et al.
patent: 5739064 (1998-04-01), Hu et al.
patent: 5750430 (1998-05-01), Son
patent: 5750435 (1998-05-01), Pan
patent: 5759901 (1998-06-01), Loh et al.
patent: 5776821 (1998-07-01), Haskell et al.
patent: 5786256 (1998-07-01), Gardner et al.
Lin Ming-Ren
Xiang Qi
Advanced Micro Devices , Inc.
Booth Richard A.
Nelson H. Donald
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