Method of manufacturing flash memory

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438257, 438196, 438218, H01L 21336

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active

060603577

ABSTRACT:
A method for manufacturing a flash memory with a shallow trench isolation and a buried bit line. In the invention, the shallow trench isolation is used as an isolation region, so that the size of the devices can be greatly reduced and the integration of the devices can be greatly increased. Additionally, the shallow trench isolation is formed in the substrate before the buried bit line implantation step is performed, so that the short channel effect caused by the lateral diffusion of the doped ions can be eliminated. Moreover, since the neighboring doped regions are electrically coupled to each other through the polysilicon layer, the access rate of the flash memory can be enhanced.

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