Semiconductor die packages having lead support frame

Details Semiconductor die packages having lead support frame Semiconductor die packages having lead support frame

1990-10-31

1993-02-02

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

361421, 257671, H01L 2348, H01L 2944

Patent

active

051842076

ABSTRACT:
A lead pack which includes a frame of polymer insulating material and a plurality of leads imbedded in said frame and extending inwardly and outwardly therefrom for attachment to an associated integrated circuit and for attachment of the leaded integrated circuit to an associated printed wiring board or like circuit. The insulating frame serves as a dam or sealing means in an encapsulating process. The same or an additional frame stabilizes and positions the outwardly extending ends of the leads. A reusable transport and test tape which includes a plurality of insulated conductors adapted to receive and connect to the leads of the lead pack and to position the lead pack for reception of an integrated circuit for bonding of lead pack leads to the contact pads of the integrated circuit and to move the lead pack and integrated circuit into succeeding processing stations where the circuit is packaged and tested and lead formed, and then excised.

REFERENCES:
patent: 3909838 (1975-09-01), Beyerlein
patent: 4028722 (1977-06-01), Helda
patent: 4234666 (1980-11-01), Gursky
patent: 4312926 (1982-01-01), Burns
patent: 4631820 (1986-12-01), Harada et al.
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4733014 (1988-03-01), Fierkens
patent: 4768077 (1988-08-01), Scherer
patent: 4771330 (1988-09-01), Long
patent: 4866504 (1989-09-01), Landis
patent: 4899207 (1990-02-01), Hallowell et al.

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