Heating – Work chamber having heating means – Having means by which work is progressed or moved mechanically
Patent
1990-08-16
1991-09-03
Bennett, Henry A.
Heating
Work chamber having heating means
Having means by which work is progressed or moved mechanically
432227, 432253, 432231, 219405, 118500, 118725, F27D 500, B05C 1300, B60L 102, F24J 300
Patent
active
050449435
ABSTRACT:
An apparatus is described for processing semiconductor wafers for the construction of integrated circuit structures thereon wherein a semiconductor wafer is supported on the upper surface of a uniformly heated susceptor. The apparatus comprises a chamber, a circular susceptor in the chamber for supporting a semiconductor wafer thereon, heating means in the chamber beneath the susceptor, and support means for peripherally supporting the susceptor in the chamber comprising 3-6 spokes which are each connected at one end to a central hub which is coaxial with the axis of the circular susceptor, but spaced therefrom to permit even thermal distribution across the susceptor, and opposite ends of the spokes peripherally supporting the susceptor adjacent the end edges thereof, to permit uniform heating of the susceptor by the heating means and uniform thermal distribution of the heat through the susceptor.
REFERENCES:
patent: 4385083 (1983-05-01), Shelley
patent: 4433246 (1984-02-01), Muka et al.
patent: 4468260 (1984-08-01), Hiramoto
patent: 4504730 (1985-03-01), Shimizu
patent: 4514250 (1985-04-01), Hwang
patent: 4580522 (1986-04-01), Fujioka et al.
patent: 4581520 (1986-04-01), Vu et al.
patent: 4625678 (1986-12-01), Shioya et al.
patent: 4654509 (1987-03-01), Robinson et al.
patent: 4817558 (1989-04-01), Itoh
patent: 4825809 (1989-05-01), Mieno
patent: 4854263 (1989-08-01), Chang et al.
patent: 4897171 (1990-01-01), Ohmi
patent: 4958061 (1990-09-01), Wakabayashi et al.
Anderson Roger N.
Bowman Russell
Applied Materials Inc.
Bennett Henry A.
Kilner Christopher B.
Taylor John P.
LandOfFree
Spoked susceptor support for enhanced thermal uniformity of susc does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Spoked susceptor support for enhanced thermal uniformity of susc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spoked susceptor support for enhanced thermal uniformity of susc will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1005571