Metal fusion bonding
Process
Bonding nonmetals with metallic filler
Inventor
active
Compliant universal substrates for optoelectronic and...
Current confinement structure for vertical cavity surface...
Current confinement structure for vertical cavity surface...
Integrated surface-emitting laser and modulator device
Semiconductor eutectic alloy metal (SEAM) technology for...
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Profile ID: LFUS-PAI-P-2054334