4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Heterojunction device

Ziv Atzmon

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Apparatus for measuring the processing temperature of workpieces

Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
Patent

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Multi-part capillary

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate

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Silicon-germanium-carbon compositions and processes thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device
Patent

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Profile ID: LFUS-PAI-P-453803

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