Apparatus for measuring the processing temperature of workpieces

Details Apparatus for measuring the processing temperature of workpieces Apparatus for measuring the processing temperature of workpieces

1997-07-11

1999-08-31

Gutierrez, Diego

Thermal measuring and testing

Temperature measurement

In spaced noncontact relationship to specimen

374126, G01J 508, G01J 502

Patent

active

059444223

ABSTRACT:
Apparatus for measuring the temperature of workpieces, particularly semiconductor wafers, during their processing, including a head assembly having a head plate circumscribed by a raised rim for receiving the workpiece and for spacing it from the head plate to define an enclosed volume between the head plate, rim, and workpiece; a thermally-conductive member, e.g., an optical fiber, passing through the head assembly and having one end exposed to the enclosed volume such that it receives thermal radiation therefrom; and a thermal detector aligned with the opposite end of the thermally-conductive member for detecting the thermal radiation received by it from the enclosed volume and for converting same to an electrical signal representing a measurement of the temperature of the enclosed volume.

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patent: 5755511 (1998-05-01), Peuse et al.
patent: 5823681 (1998-10-01), Cabib et al.

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