4. Stock material or miscellaneous articles
  5. Structurally defined web or sheet
  6. Including components having same physical characteristic in...

Ziptronix, Inc.

Corporate Assignee

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Corporate Assignee

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3D IC method and device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Method for low temperature bonding and bonded structure

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Method for low temperature bonding and bonded structure

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Method for low temperature bonding and bonded structure

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Method for low temperature bonding and bonded structure

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2195492

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