4. Metal fusion bonding
  5. Process
  6. With protecting of work or filler or applying flux

Zhao Ya Rui

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Apparatus and method to prevent oxidation of electronic devices

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Assembly for reducing oxidation of semiconductor devices

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2811379

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