Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2005-03-15
2005-03-15
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C228S004500, C228S180500, C228S042000
Reexamination Certificate
active
06866182
ABSTRACT:
The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which said device is to be heated and inlet means adapted to supply a relatively inert gas to the said area. In particular, the apparatus includes a porous distribution element through which the inert gas is passed from the inlet means to said area, whereby to protect the electronic device in the area from oxidation.
REFERENCES:
patent: 4998002 (1991-03-01), Okikawa et al.
patent: 5232144 (1993-08-01), Carney et al.
patent: 5364007 (1994-11-01), Jacobs et al.
patent: 5569075 (1996-10-01), Leturmy
patent: 5981897 (1999-11-01), Offer et al.
patent: 6412681 (2002-07-01), Mukuno et al.
patent: 63055949 (1988-03-01), None
Duan Rong
Kwan Ka Shing Kenny
Rui Zhao Ya
Wong Yam Mo
ASM Technology Singapore PTE Ltd.
McHenry Kevin
Ostrolenk Faber Gerb & Soffen, LLP
Stoner Kiley S.
LandOfFree
Apparatus and method to prevent oxidation of electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method to prevent oxidation of electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method to prevent oxidation of electronic devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3382940