Apparatus and method to prevent oxidation of electronic devices

Metal fusion bonding – Process – With protecting of work or filler or applying flux

Reexamination Certificate

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C228S004500, C228S180500, C228S042000

Reexamination Certificate

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06866182

ABSTRACT:
The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which said device is to be heated and inlet means adapted to supply a relatively inert gas to the said area. In particular, the apparatus includes a porous distribution element through which the inert gas is passed from the inlet means to said area, whereby to protect the electronic device in the area from oxidation.

REFERENCES:
patent: 4998002 (1991-03-01), Okikawa et al.
patent: 5232144 (1993-08-01), Carney et al.
patent: 5364007 (1994-11-01), Jacobs et al.
patent: 5569075 (1996-10-01), Leturmy
patent: 5981897 (1999-11-01), Offer et al.
patent: 6412681 (2002-07-01), Mukuno et al.
patent: 63055949 (1988-03-01), None

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