Assembly for reducing oxidation of semiconductor devices

Details Assembly for reducing oxidation of semiconductor devices Assembly for reducing oxidation of semiconductor devices

2008-06-06

2009-08-25

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

C228S042000, C228S049500

Reexamination Certificate

active

07578423

ABSTRACT:
An assembly for reducing oxidation of a semiconductor device comprises a holding device for securing the semiconductor device to a platform. The holding device includes at least one opening for providing access by a bonding tool to bonding areas where the semiconductor device is to be bonded. A slidable cover covers the holding device and has a slot for providing access by the bonding tool to the bonding areas through the slot. A guiding device is positioned on the slidable cover and is coupled to a pusher which is operative to push the slidable cover to move along a first axis. The pusher is further guided by the guiding device to move relative to the slidable cover along a second axis which is perpendicular to the first axis without pushing the slidable cover to move in the second axis.

REFERENCES:
patent: 4583676 (1986-04-01), Pena et al.
patent: 4938834 (1990-07-01), Yamamoto et al.
patent: 5162068 (1992-11-01), Yamamoto et al.
patent: 5272800 (1993-12-01), Rooney et al.
patent: 5307978 (1994-05-01), Ricketson et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5372972 (1994-12-01), Hayashi et al.
patent: 5431329 (1995-07-01), Hasegawa et al.
patent: 5622304 (1997-04-01), Sato
patent: 5796161 (1998-08-01), Moon
patent: 5823416 (1998-10-01), Haji
patent: 6062459 (2000-05-01), Sabyeying
patent: 6334566 (2002-01-01), Ball et al.
patent: 6824037 (2004-11-01), Sakai et al.
patent: 6866182 (2005-03-01), Wong et al.
patent: 7103959 (2006-09-01), Yeap et al.
patent: 7134589 (2006-11-01), Balon
patent: 7182793 (2007-02-01), Duan et al.
patent: 7303109 (2007-12-01), Kwan et al.
patent: 2001/0007084 (2001-07-01), Koo et al.
patent: 2004/0026486 (2004-02-01), Evers et al.
patent: 2004/0065720 (2004-04-01), Wong et al.
patent: 2005/0001018 (2005-01-01), Kwan et al.
patent: 2005/0161488 (2005-07-01), Duan et al.
patent: 2006/0011701 (2006-01-01), Duan et al.
patent: 2007/0284421 (2007-12-01), Gillotti et al.
patent: 59025232 (1984-02-01), None
patent: 03225931 (1991-10-01), None

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