4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Zafer S. Kutlu

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Embedded strain gauge in printed circuit boards

Measuring and testing – Dynamometers – Responsive to force
Reexamination Certificate

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Enhanced laminate flipchip package using a high CTE...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Integrated circuit package having a stiffener dimensioned to rec

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Method of planarizing die solder balls by employing a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Process of grounding heat spreader/stiffener to a flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1344305

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