4. Semiconductor device manufacturing: process
  5. Making device or circuit responsive to nonelectrical signal
  6. Physical stress responsive

Yun-sheng Chen

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Multi-chip semiconductor package structure

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Multi-chip semiconductor package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2533044

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