4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Outside periphery of package having specified shape or...

Yukinori Tabira

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Leadless type semiconductor package, and production process...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Leadless type semiconductor package, and production process...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadless type semiconductor package, and production process...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3039843

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