Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-01-05
2010-02-02
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S106000, C438S121000, C438S124000, C257SE21001
Reexamination Certificate
active
07655506
ABSTRACT:
A leadless type resin-sealed semiconductor package includes a resin enveloper having a mounting face to be applied to a wiring board, and at least one side face associated with the mounting face to produce an angled side edge. A semiconductor chip is encapsulated and sealed in the resin enveloper. An electrode terminal is partially buried in the angled side edge of the resin enveloper so as to be exposed to an outside, with the electrode terminal being electrically connected to the semiconductor chip. The electrode terminal is formed with a depression which is shaped so as to be opened to an outside when the resin enveloper is placed on the wiring board such that the mounting face of the resin enveloper is applied thereto.
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Garber Charles D
NEC Electronics Corporation
Roman Angel
Sughrue & Mion, PLLC
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