4. Food or edible material: processes, compositions, and products
  5. Packaged or wrapped product
  6. Having specific electrical or wave energy feature

Yuji Kunimoto

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Chip embedded substrate and method of producing the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Erectable container

Envelopes – wrappers – and paperboard boxes – Paperboard box – Including a polygonal – nonrectangular wall
Patent

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Food material-container combination

Food or edible material: processes – compositions – and products – Packaged or wrapped product – Having specific electrical or wave energy feature
Patent

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Mounting substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Premix for cooking by a microwave oven and process of preparatio

Food or edible material: processes – compositions – and products – Packaged or wrapped product – Having specific electrical or wave energy feature
Patent

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Profile ID: LFUS-PAI-P-337432

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