4. Powder metallurgy processes
  5. Powder metallurgy processes with heating or sintering
  6. Special medium during sintering

Yugaku Abe

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Composite material and semiconductor device using the same

Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate

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Housing for semiconductor device

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Special medium during sintering
Patent

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Housing for semiconductor device with occlusion gas removed

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent

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Nitrogenous aluminum-silicon powder metallurgical alloy

Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
Patent

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Radiating fin having an improved life and thermal conductivity

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Profile ID: LFUS-PAI-P-509708

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