4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Yu H. Sun

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Integrated circuit bus grid having wires with pre-selected...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method for locating I DDQ defects using multiple controlled...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Method for locating IDDQ defects using multiple controlled...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Method of designing a voltage partitioned solder-bump package

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Method of designing a voltage partitioned wirebond package

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2612827

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