4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Foil or filament smaller than 6 mils

Yoshio Ohzeki

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Bonding wire for semiconductor element

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent

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Composite lead frame and semiconductor device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Method of producing fine metal balls

Specialized metallurgical processes – compositions for use therei – Processes – Producing solid particulate free metal directly from liquid...
Patent

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Profile ID: LFUS-PAI-P-424429

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