4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with the removal of material by nonchemical means

Yoshio Mezaki

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GaAs semiconductor substrate and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – In compound semiconductor material
Reexamination Certificate

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Method of manufacturing compound semiconductor wafer

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2916352

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