Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Inventor
active
Anisotropic conductive film with through-holes filled with metal
Film carrier and semiconductor device using same
Film carrier for fine-pitched and high density mounting and semi
Image fixing apparatus and thin tube-like endless film...
Method for producing circuit substrate having bump contact point
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Profile ID: LFUS-PAI-P-652408