Film carrier for fine-pitched and high density mounting and semi

Details Film carrier for fine-pitched and high density mounting and semi Film carrier for fine-pitched and high density mounting and semi

1996-08-06

1999-03-02

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257774, 257777, 257737, H01L 2348

Patent

active

058775595

ABSTRACT:
In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

REFERENCES:
patent: 4499655 (1985-02-01), Anthony
patent: 5136359 (1992-08-01), Takayama et al.
patent: 5433822 (1995-07-01), Mimura et al.
patent: 5434452 (1995-07-01), Higgins, III
patent: 5468681 (1995-11-01), Pasch
patent: 5470790 (1995-11-01), Myers et al.
patent: 5559372 (1996-09-01), Kwon

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