Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1997-09-26
2000-01-25
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205 98, 205125, 205126, C25D 508
Patent
active
060174382
ABSTRACT:
A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.
REFERENCES:
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5421985 (1995-06-01), Clouser et al.
Patent Abstract of Japan, Horasawa Takayasu, "Method of Plating Bump of Semiconductor Device", Nov. 6, 1992, 04315434 A.
Patent Abstract of Japan, Hirose Yoshima, "Plating Device of Plated Material Having Fine Plated Region", Jan. 13, 1995, 07011498 A.
Patent Abstract of Japan, Garetsuto EE Garetsutoson et al., "Testing Probe", Aug. 11, 1987.
Patent Abstract of Japan, Sakaida Atsusuke, "Plating Device", Mar. 1, 1990.
Lowenheim, Frederick A., Electroplating, McGraw-Hill, pp. 138-141, Jan. 8, 1979.
Naito Toshiki
Ouchi Kazuo
Takayama Yoshinari
Gorgos Kathryn
Nicolas Wesley A.
Nitto Denko Corporation
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