Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
Inventor
active
Final speed-reduction gearing assembly in transmission unit
Lead frame and semiconductor device using same
Lead frame and semiconductor device using same
Metal plane support for multi-layer lead frames and a process fo
Method of production of circuit board utilizing electroplating
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Profile ID: LFUS-PAI-P-809616