Lead frame and semiconductor device using same

Details Lead frame and semiconductor device using same Lead frame and semiconductor device using same

1992-12-03

1994-03-01

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257672, 257676, H01L 2348

Patent

active

052910601

ABSTRACT:
A multi-layer lead frame is provided with a lead frame body made of a metal strip and having a plurality of inner leads including respective tips which define an opening. A power supply metal plane is adhered to the inner leads and a ground metal plane is adhered to the power supply metal plane by insulative adhesive layers. These metal planes are provided with first wire bonding areas and through holes in the vicinity thereof. A semiconductor device comprises such a multi-layer lead frame, a semiconductor chip mounted on a stage thereof, bonding-wires electrically connecting the chip to the areas, and a resin integrally molding the multi-layer lead frame, the chip, and the bonding-wires in such a manner that the through holes are filled with the resin.

REFERENCES:
patent: 4796078 (1989-01-01), Phelps Jr. et al.
patent: 4805009 (1989-02-01), Pryor et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 5175060 (1992-12-01), Enomoto et al.

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