BGA semiconductor device including a plurality of semiconductor

Details BGA semiconductor device including a plurality of semiconductor BGA semiconductor device including a plurality of semiconductor

1995-07-24

1997-03-25

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257723, 257724, 361761, H05K 118

Patent

active

056150890

ABSTRACT:
A semiconductor device includes a first substrate carrying semiconductor chips on both upper and lower major surfaces thereof, a second substrate carrying the first substrate, and a resin package body having a first part for embedding the semiconductor chips on the upper major surface of the first substrate and a second part for embedding the semiconductor chips on the lower major surface of the first substrate, wherein the second substrate carries on a lower major surface thereof solder bumps forming a BGA structure.

REFERENCES:
patent: 5060844 (1991-10-01), Behun et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5473190 (1995-12-01), Inoue et al.
patent: 5519176 (1996-05-01), Goodman et al.

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